Abstract: Through-silicon via (TSV) as a crucial interconnection microstructure in three-dimensional (3D) chip, have significantly enhanced device performance and reliability. However, the increasing ...
Abstract: A numerical methodology for evaluating the effect of filler particle size distribution and volume fraction on the effective thermal and electrical properties of polymer insulation materials ...
Merve Ceylan is a dietitian and health writer with four years of experience writing for companies in the nutrition and health industry. Kristie Reed, PharmD, oversees emergency, general medical, ...
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