Power-SOI has been produced by SOITEC for decades in 200mm and smaller wafer sizes, with typical SOI top layer thickness in the micrometer range. Leveraging its Smart Cut™ technology, SOITEC has ...

The demonstration design uses the ams OSRAM AS6212 temperature sensor and STMicroelectronics LIS2DW12 accelerometer boards ...

Yannick Bedin, CEO of Eumetrys, discusses the company’s metrology expertise, looking at the ways in which it is helping its customers to address the key challenges and opportunities they face within ...

Recent patent filings emphasise critical aspects of power GaN technology such as gate design and packaging, resulting in ...

The EPC9196 has been validated in real-world conditions, powering a 3-kW servo motor at 150 VDC and 60 kHz switching ...

GaN-on-SiC epitaxial wafer company SweGaN has appointed Pontus de Laval, senior advisor at one of SweGaN’s major shareholders ...

US start-up Gallox Semiconductors has won the 2025 Hello Tomorrow Global Challenge in the Advanced Computing & Electronics category.

Navitas Semiconductor has announced a partnership with BrightLoop supporting their latest series of hydrogen fuel-cell ...

“Our collaboration with Infineon has led to significant advances in UAV electronics,” says Amrit Singh, founder of Reflex ...

Mike Frank, Senior Scientist and Rodolfo Rosini, CEO, both at Vaire Computing, explain how reversible computing, as an ...

TrendForce adds that while Renesas has reportedly decided to halt in-house production of SiC power chips, the company does ...

Gustavo Sepulveda, Process Automation Business Head for Panasonic Connect, discusses outlines the company’s new NPM-GW ...