Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company ...

Japanese chipmaker Renesas Electronics has scrapped its plan to mass-produce silicon carbide (SiC) power semiconductors, originally set to begin in early 2025 at its Takasaki plant in Gunma Prefecture ...

The new USB Type-C Cable and Connector Specification Release 2.4 has reduced voltage detection thresholds (0.613V for 1.5A ...

A new high-performance microprocessor (MPU) in the RTOS-based RZ/A series from Renesas Electronics Corporation is designed to meets the growing demands of advanced human-machine interface (HMI) ...

Zaher, currently Vice President of the Timing Division within the Analog & Connectivity product group, joined Renesas in 2019 through the acquisition of Integrated Device Technology, Inc. He brings a ...

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Renesas’ RA2L2 ultra-low-power MCUs, with USB-C Rev. 2.4 support, target portable devices and PC peripherals. Renesas ...

TOKYO, April 24, 2025--Renesas Electronics Corporation (TSE:6723) announced consolidated financial results in accordance with IFRS for the three months ended March 31, 2025. TOKYO, April 22 ...

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the appointment of Zaher Baidas as Senior Vice President and General Manager of ...

Renesas Electronics has introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and support for the ...